Tangential flow filtration of ceria slurry: Application of a single-pass method to improve buff cleaning

Autor:	Lee, Jaewon, Seo, Hyeonmin, Park, Sang-Hyeon, Kim, Eungchul, Lee, Jungryul, Liu, Pengzhan, Jeon, Sanghuck, Hong, Seokjun, Kim, Taesung
Zdroj:	In Materials Science in Semiconductor Processing July 2022 145
Databáze:	ScienceDirect
Externí odkaz:	Zobrazit plný text záznamu Full Text from ScienceDirect