Tangential flow filtration of ceria slurry: Application of a single-pass method to improve buff cleaning
Autor: | Lee, Jaewon, Seo, Hyeonmin, Park, Sang-Hyeon, Kim, Eungchul, Lee, Jungryul, Liu, Pengzhan, Jeon, Sanghuck, Hong, Seokjun, Kim, Taesung |
---|---|
Zdroj: | In Materials Science in Semiconductor Processing July 2022 145 |
Databáze: | ScienceDirect |
Externí odkaz: |