Die-attach bonding for high temperature applications using thermal decomposition of copper(II) formate with polyethylene glycol
| Autor: | Bhogaraju, Sri Krishna, Mokhtari, Omid, Conti, Fosca, Elger, Gordon |
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| Zdroj: | In Scripta Materialia June 2020 182:74-80 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect