Enhanced TiAl/Ti3SiC2 diffusion bonding by introducing amorphous intergranular films in Ti3SiC2 through Al doping

Autor: Wang, Qi, Chen, Guo-qing, Wang, Kang, Fu, Xue-song, Zhou, Wen-long
Zdroj: In Scripta Materialia 15 March 2020 178:493-497
Databáze: ScienceDirect