Ultra thermal stability of LED die-attach achieved by pressureless Ag stress-migration bonding at low temperature
| Autor: | Kunimune, Teppei, Kuramoto, Masafumi, Ogawa, Satoru, Sugahara, Tohru, Nagao, Shijo, Suganuma, Katsuaki |
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| Zdroj: | In Acta Materialia 1 May 2015 89:133-140 |
| Databáze: | ScienceDirect |
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