Effect of transient current bonding on interfacial reaction in Ag-coated graphene Sn–Ag–Cu composite solder joints
| Autor: | HAN, Yong-dian, YANG, Jia-hang, XU, Lian-yong *, JING, Hong-yang, ZHAO, Lei |
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| Zdroj: | In Transactions of Nonferrous Metals Society of China August 2021 31(8):2454-2467 |
| Databáze: | ScienceDirect |
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