Using neural networks and immune algorithms to find the optimal parameters for an IC wire bonding process
| Autor: | (Tony) Hou, Tung-Hsu, Su, Chi-Hung, Chang, Hung-Zhi |
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| Zdroj: | In Expert Systems With Applications 2008 34(1):427-436 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect