Thermal and mechanical analysis of high-power GaAs flip-chips on CVD diamond substrates
| Autor: | Brown, M.D., Singh, S.B., Malshe, A.P. *, Gordon, M.H., Schmidt, W.F., Brown, W.D. |
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| Zdroj: | In Diamond & Related Materials 1999 8(10):1927-1935 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect