sSOI fabrication by wafer bonding and layer splitting of thin SiGe virtual substrates
| Autor: | Radu, I., Himcinschi, C., Singh, R., Reiche, M., Gösele, U., Christiansen, S.H., Buca, D., Mantl, S., Loo, R., Caymax, M. |
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| Zdroj: | In Materials Science & Engineering B 2006 135(3):231-234 |
| Databáze: | ScienceDirect |
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