Understanding the deformation creep and role of intermetallic compound-microstructure in Sn-Ag-Cu solders

Autor:	Gu, Tianhong, Xu, Yilun, Gourlay, Christopher M., Dunne, Fionn P.E., Britton, T. Ben
Zdroj:	In Materials Science & Engineering A December 2024 918
Databáze:	ScienceDirect
Externí odkaz:	Full Text from ScienceDirect