Thermodynamic modeling framework with experimental investigation of the large-scale bonded area and local void in Cu-Cu bonding interface for advanced semiconductor packaging
| Autor: | Oh, Sung-Hyun, Lee, Hyun-Dong, Lee, Jae-Uk, Park, Sung-Ho, Cho, Won-Seob, Park, Yong-Jin, Haag, Alexandra, Watanabe, Soichi, Arnold, Marco, Lee, Hoo-Jeong, Lee, Eun-Ho |
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| Zdroj: | In International Journal of Plasticity September 2024 180 |
| Databáze: | ScienceDirect |
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