Reduced warpage in semiconductor packages: Optimizing post-cure temperature profile considering cure shrinkage and viscoelasticity of epoxy molding compound
| Autor: | Um, Hui-Jin, Ju, Young-Min, Lee, Dae-Woong, Ahn, Jinho, Kim, Hak-Sung |
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| Zdroj: | In Materials & Design September 2024 245 |
| Databáze: | ScienceDirect |
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