Modeling of bonding pressure based on the plastic deformation mechanism of interfacial voids closure in solid-state diffusion bonding
| Autor: | Peng, Yu, Li, Jinglong, Li, Zhaoxi, Guo, Zilong, Guo, Wei, Xiong, Jiangtao |
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| Zdroj: | In Materials & Design September 2024 245 |
| Databáze: | ScienceDirect |
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