Effect of Ru crystal orientation on the adhesion characteristics of Cu for ultra-large scale integration interconnects
| Autor: | Kim, Hoon, Koseki, Toshihiko, Ohba, Takayuki, Ohta, Tomohiro, Kojima, Yasuhiko, Sato, Hiroshi, Hosaka, Shigetoshi, Shimogaki, Yukihiro |
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| Zdroj: | In Applied Surface Science 2006 252(11):3938-3942 |
| Databáze: | ScienceDirect |
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