Quantification of shear induced agglomeration in chemical mechanical polishing slurries under different chemical environments

Autor: Khanna, Aniruddh J., Gupta, Sushant, Kumar, Purushottam, Chang, Feng-Chi, Singh, Rajiv K.
Zdroj: In Microelectronic Engineering 1 April 2019 210:1-7
Databáze: ScienceDirect