Supercritical fluid chemical deposition of Cu in Ru and TiN-lined deep nanotrenches using a new Cu(I) amidinate precursor

Autor: Rasadujjaman, Md, Watanabe, Mitsuhiro, Sudoh, Hiroshi, Machida, Hideaki, Kondoh, Eiichi
Zdroj: In Microelectronic Engineering 2 April 2015 137:32-36
Databáze: ScienceDirect