Moisture absorption impact on Cu alloy/low-k reliability during process queue time
| Autor: | Tsuchiya, H., Yokogawa, S., Kunishima, H., Kuwajima, T., Usami, T., Miura, Y., Ohto, K., Fujii, K., Sakurai, M. |
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| Zdroj: | In Microelectronic Engineering June 2013 106:205-209 |
| Databáze: | ScienceDirect |
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