Copper stress migration at narrow metal finger with wide lead
| Autor: | Wang, Robin C.J., Chang-Liao, K.S., Oates, A.S., Lee, C.C., Chen, L.D., Chiu, C.C., Wu, Kenneth |
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| Zdroj: | In Microelectronic Engineering 2007 84(11):2697-2701 |
| Databáze: | ScienceDirect |
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