Influence of SiH4 process step on physical and electrical properties of advanced copper interconnects
| Autor: | Chhun, S. *, Gosset, L.G., Casanova, N., Guillaumond, J.F., Dumont-Girard, P., Federspiel, X., Pantel, R., Arnal, V., Arnaud, L., Torres, J. |
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| Zdroj: | In Microelectronic Engineering October 2004 76(1-4):106-112 |
| Databáze: | ScienceDirect |
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