Surface treatment of wire bonding metal pads
| Autor: | Alberici, S., Coulon, D., Joubin, P., Mignot, Y., Oggioni, L., Petruzza, P., Piumi, D., Zanotti, L. ∗ |
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| Zdroj: | In Microelectronic Engineering 2003 70(2):558-565 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Alberici, S., Coulon, D., Joubin, P., Mignot, Y., Oggioni, L., Petruzza, P., Piumi, D., Zanotti, L. ∗ |
|---|---|
| Zdroj: | In Microelectronic Engineering 2003 70(2):558-565 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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Full Text from ScienceDirect