Effect of vacuum diffusion bonding on the mechanical and conductive properties of bonded bulk copper single crystals

Autor: Xing, Z.B., Xu, X.Q., Kong, L.W., Pang, L., Liu, X., Shu, Y., Qi, Z.X., Li, P.
Zdroj: In Vacuum October 2024 228
Databáze: ScienceDirect