Effect of vacuum diffusion bonding on the mechanical and conductive properties of bonded bulk copper single crystals
Autor: | Xing, Z.B., Xu, X.Q., Kong, L.W., Pang, L., Liu, X., Shu, Y., Qi, Z.X., Li, P. |
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Zdroj: | In Vacuum October 2024 228 |
Databáze: | ScienceDirect |
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