Effect of evaporated copper and aluminum on post-annealed SiOC(–H) films deposited using plasma-enhanced chemical vapor deposition
| Autor: | Kim, Chang Young, Lee, Heang Seuk, Navamathavan, R., Woo, Jong-Kwan, Choi, Chi Kyu |
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| Zdroj: | In Thin Solid Films 2010 518(22):6469-6473 |
| Databáze: | ScienceDirect |
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