Tensile strain engineering of Si thin films using porous Si substrates

Autor: Boucherif, A., Blanchard, N.P., Regreny, P., Marty, O., Guillot, G., Grenet, G., Lysenko, V.
Zdroj: In Thin Solid Films 2010 518(9):2466-2469
Databáze: ScienceDirect