Effect of interface modification on EM-induced degradation mechanisms in copper interconnects
| Autor: | Zschech, E., Meyer, M.A., Mhaisalkar, S.G., Vairagar, A.V., Krishnamoorthy, A., Engelmann, H.J., Sukharev, V. |
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| Zdroj: | In Thin Solid Films 2006 504(1):279-283 |
| Databáze: | ScienceDirect |
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