Electromigration Cu mass flow in Cu interconnections
| Autor: | Hu, C.-K., Canaperi, D., Chen, S.T., Gignac, L.M., Kaldor, S., Krishnan, M., Malhotra, S.G., Liniger, E., Lloyd, J.R., Rath, D.L., Restaino, D., Rosenberg, R., Rubino, J., Seo, S.-C., Simon, A., Smith, S., Tseng, W.-T. |
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| Zdroj: | In Thin Solid Films 2006 504(1):274-278 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect