Uniaxially strained silicon by wafer bonding and layer transfer
| Autor: | Himcinschi, C., Radu, I., Muster, F., Singh, R., Reiche, M., Petzold, M., Gösele, U., Christiansen, S.H. |
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| Zdroj: | In Solid State Electronics 2007 51(2):226-230 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect