Rapid on-site nondestructive surface corrosion characterization of sintered nanocopper paste in power electronics packaging using hyperspectral imaging
| Autor: | Chen, Wei, Feng, Shuo, Liu, Xu, Hu, Dong, Zhu, Xi, Yao, Qi, Fan, Xuejun, Zhang, Guoqi, Fan, Jiajie |
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| Zdroj: | In Microelectronics Reliability November 2024 162 |
| Databáze: | ScienceDirect |
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