Cluster-aware allocation of spare TSVs for enhanced reliability in 3D ICs

Autor:	Maity, Dilip Kumar, Roy, Surajit Kumar, Giri, Chandan
Zdroj:	In Microelectronics Reliability December 2023 151
Databáze:	ScienceDirect
Externí odkaz:	Zobrazit plný text záznamu Full Text from ScienceDirect