In-situ delamination detection in multi-layered semiconductor packages
Autor: | Walter, T., Khatibi, G., Betzwar Kotas, A., Kretschy, N. |
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Zdroj: | In Microelectronics Reliability November 2023 150 |
Databáze: | ScienceDirect |
Externí odkaz: |
Autor: | Walter, T., Khatibi, G., Betzwar Kotas, A., Kretschy, N. |
---|---|
Zdroj: | In Microelectronics Reliability November 2023 150 |
Databáze: | ScienceDirect |
Externí odkaz: |