A combined modelling approach to design test structures to study thermomigration in Cu interconnects
| Autor: | Ding, Y., Lofrano, M., Varela Pedreira, O., Zahedmanesh, H., Croes, K., De Wolf, I. |
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| Zdroj: | In Microelectronics Reliability November 2022 138 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect