Research on sintering process and thermal conductivity of hybrid nanosilver solder paste based on molecular dynamics simulation
| Autor: | Zhang, Zhongqing, Fu, Guicui, Wan, Bo, Su, Yutai, Jiang, Maogong |
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| Zdroj: | In Microelectronics Reliability November 2021 126 |
| Databáze: | ScienceDirect |
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