Microstructural characterization of alloyed palladium coated copper wire under high temperature
| Autor: | Eto, Motoki, Araki, Noritoshi, Yamada, Takashi, Sugiyama, Masaaki, Fujimoto, Shinji |
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| Zdroj: | In Microelectronics Reliability May 2021 120 |
| Databáze: | ScienceDirect |
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