Creep fatigue models of solder joints: A critical review
| Autor: | Wong, E.H., van Driel, W.D., Dasgupta, A., Pecht, M. |
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| Zdroj: | In Microelectronics Reliability April 2016 59:1-12 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Wong, E.H., van Driel, W.D., Dasgupta, A., Pecht, M. |
|---|---|
| Zdroj: | In Microelectronics Reliability April 2016 59:1-12 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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Full Text from ScienceDirect