Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability
| Autor: | Tsai, M.Y., Huang, P.S., Lin, C.H., Wu, C.T., Hu, S.C. |
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| Zdroj: | In Microelectronics Reliability December 2015 55(12) Part A:2589-2595 |
| Databáze: | ScienceDirect |
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