Creep lifetime prediction of solder joint for heat sink assembly
| Autor: | Han, Changwoon ⁎, Oh, Chulmin, Park, Nochang, Hong, Wonsik |
|---|---|
| Zdroj: | In Microelectronics Reliability 2010 50(9):1645-1649 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Han, Changwoon ⁎, Oh, Chulmin, Park, Nochang, Hong, Wonsik |
|---|---|
| Zdroj: | In Microelectronics Reliability 2010 50(9):1645-1649 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect