Numerical modeling of warpage induced in QFN array molding process
| Autor: | Yang, D.G., Jansen, K.M.B., Ernst, L.J., Zhang, G.Q., van Driel, W.D., Bressers, H.J.L., Janssen, J.H.J. |
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| Zdroj: | In Microelectronics Reliability 2007 47(2):310-318 |
| Databáze: | ScienceDirect |
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