Experimental and multiphysics simulation study of atoms migration and morphology evolution in solder joints under high current density
| Autor: | Jia, Fei, Niu, Leyi, Xi, Yuchen, Qiu, Yuanying, Ma, Hongbo, Yang, Chengpeng |
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| Zdroj: | In International Journal of Heat and Mass Transfer March 2023 202 |
| Databáze: | ScienceDirect |
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