Thermal Conductivity and Microstructure of Copper Coated Graphite Composite by Spark Plasma Sintering Process

Autor:	Park S.H., Kim D.B., Lee R.G., Son I.J.
Jazyk:	angličtina
Rok vydání:	2017
Předmět:	Metal matrix composites Thermal conductivity Thermal expansion Interfacial bonding Spark plasma sintering Mining engineering. Metallurgy TN1-997 Materials of engineering and construction. Mechanics of materials TA401-492
Zdroj:	Archives of Metallurgy and Materials, Vol 62, Iss 2, Pp 1303-1306 (2017)
Druh dokumentu:	article
ISSN:	2300-1909 84130121
DOI:	10.1515/amm-2017-0197
Popis:	This study focuses on the fabrication of thermal management material for power electronics applications using graphite flake reinforced copper composites. The manufacturing route involved electroless plating of copper in the graphite flake and sintering process are optimized. The microstructures, interface, thermal properties, and relative density of graphite/Cu composites are investigated. The relative density of the composites shows 99.5% after sintering. Thermal conductivities and coefficients of thermal expansion of this composites were 400-480 Wm−1K−1 and 8 to 5 ppm k−1, respectively. Obtained graphite nanoplatelets-reinforced composites exhibit excellent thermo-physical properties to meet the heat dispersion and matching requirements of power electronic devices to the packaging materials.
Databáze:	Directory of Open Access Journals
Externí odkaz:	https://doaj.org/article/b98687fef6ec4f6d84130121a9b1492b Zobrazit plný text záznamu View record in DOAJ Plný text ve formátu PDF