| Autor: |
Gui-sheng Gan, Tian Huang, Shi-qi Chen, Liu-jie Jiang, Da-yong Cheng, Shu-ye Zhang |
| Jazyk: |
angličtina |
| Rok vydání: |
2023 |
| Předmět: |
|
| Zdroj: |
Memories - Materials, Devices, Circuits and Systems, Vol 4, Iss , Pp 100026- (2023) |
| Druh dokumentu: |
article |
| ISSN: |
2773-0646 |
| DOI: |
10.1016/j.memori.2023.100026 |
| Popis: |
Composite solders of 1μmZn particles and Sn-0.3Ag-0.7Cu (SAC0307) with a particle size of 25∼38μmwas used to achieve micro-joining of Cu/Cu under ultrasonic-assisted at 180 °C, and aging at 125 °C was used to strengthen Cu/Cu joints. The results showed that interface intermetallic compounds (IMCs) between Cu substrates and solder were mainly smooth Cu5Zn8, and the Zn–Sn–Cu phase was formed to complete interconnection between SAC0307 particles at 180 °C. With the increase of aging time, the shear strength of joints first increased and reached a peak value of 36.26MPa at 2h which was 21.8% higher than that of the as-received joints, then the shear strength decreased and tended to be stable at 24h which was increased by 10.0% compared with that of the as-received joints. |
| Databáze: |
Directory of Open Access Journals |
| Externí odkaz: |
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