| Autor: |
Marcos D. Fernandez, Angel Belenguer, Dario Herraiz, Leticia Martinez, Jose A. Ballesteros |
| Jazyk: |
angličtina |
| Rok vydání: |
2024 |
| Předmět: |
|
| Zdroj: |
IEEE Access, Vol 12, Pp 61336-61342 (2024) |
| Druh dokumentu: |
article |
| ISSN: |
2169-3536 |
| DOI: |
10.1109/ACCESS.2024.3395156 |
| Popis: |
It is well-known that Empty Substrate Integrated Waveguides allow not only the integration of classic waveguides, such as rectangular waveguides, into a printed circuit board maintaining the quality of traditional waveguide devices, but also keeping in these circuits the advantages of planar devices: low cost, high integration and mass production capabilities. Nevertheless, a critical point to consider in the success of manufacturing these devices is the soldering of metal covers that close the structure and create the waveguide. This paper presents a new soldering process that simplifies the former procedures, making it easier and reducing economic and time costs. To validate this new assembling procedure, two prototypes have been manufactured and measured: a back-to-back from microstrip to ESIW, and a Ku-band filter; repeteability of the fabrication process has been proved and high performance results have been obtained. |
| Databáze: |
Directory of Open Access Journals |
| Externí odkaz: |
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