Experimental and Numerical Analysis of the Thermal Conductivity of SiCf/SiC Composites

Autor: Zhaoguo Mi, Zhenhua Chen, Weihua Yang
Jazyk: angličtina
Rok vydání: 2023
Předmět:
Zdroj: Advances in Materials Science and Engineering, Vol 2023 (2023)
Druh dokumentu: article
ISSN: 1687-8442
DOI: 10.1155/2023/6522013
Popis: SiC fiber-reinforced silicon matrix (SiCf/SiC) composites are of significant interest for the aircraft engine. The thermal conductive behaviors of [0-90-0]s SiCf/SiC composites along in-plane and out-of-plane (thickness) directions were reported in this paper. The thermal conductivity of the SiCf/SiC composite was tested by using the steady-state measuring apparatus. Then, the thermal conductivity of the SiC matrix was predicted by finite element analysis (FEA). The representative volume element (RVE) models of SiCf/SiC composites were built, and FEA was used to investigate thermal conductive behaviors. It was found that the thermal conductivity along the fiber radial direction was greater than it was in the axial direction in the SiCf/SiC composite and that the thermal conductivity of the out-of-plane direction is lower than that of the in-plane one. The thermal conductivity of the SiCf/SiC composite in the in-plane direction at room temperature was 31.1 Wm−1K−1 and 28.5 Wm−1K−1, and the thermal conductivity in the thickness direction was 24.9 Wm−1K−1. The experimental thermal conductivity showed a good agreement with the thermal conductivity of FEA.
Databáze: Directory of Open Access Journals
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