| Autor: |
Jingzhi Zhang, Jinjin Xu, Hao Han, Li Lei, Gongming Xin |
| Jazyk: |
angličtina |
| Rok vydání: |
2024 |
| Předmět: |
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| Zdroj: |
Case Studies in Thermal Engineering, Vol 60, Iss , Pp 104669- (2024) |
| Druh dokumentu: |
article |
| ISSN: |
2214-157X |
| DOI: |
10.1016/j.csite.2024.104669 |
| Popis: |
The investigation of staggered finned manifold microchannel (MMC) for addressing thermal management challenges in high heat flux electronic devices presents promising insights. The research indicates that staggered finned MMCs exhibit superior heat transfer characteristics in comparison to traditional rectangular microchannels, particularly under single-phase flow conditions. When staggered finned microchannels reduce the maximum temperature of the heating surface by around 10 K, the pressure drop is reduced by 1.3 kPa. Notably, as the heat flux escalates, the advantages of staggered finned MMCs become increasingly pronounced, while higher flow rates lead to a gradual diminishment of these advantages. Furthermore, in scenarios involving flow boiling with low heat flux and high flow conditions, staggered finned MMCs demonstrate enhanced heat transfer performance over traditional rectangular microchannels. When staggered finned microchannels reduce the maximum temperature of the heating surface by around 3 K, the pressure drop is improved by 1.2 kPa. Moreover, the study underscores that at lower flow rates, staggered finned MMCs experience a reduced pressure drop relative to traditional rectangular microchannels, whereas at higher flow rates, this trend is reversed. These findings carry significant implications for the optimization of thermal management strategies for electronic devices operating under high heat flux conditions. |
| Databáze: |
Directory of Open Access Journals |
| Externí odkaz: |
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