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The ability to fabricate functional 3D conductive elements via additive manufacturing has opened up a unique sector of ‘hybridized printed electronics’. In doing so, many of the rigid standards (i.e., planar circuit boards, potting, etc.,) of traditional electronics are abandoned. However, one critical challenge lies in producing robust and reliable interconnections between conductive inks and traditional hardware, especially when subjected to harsh environments. This research examines select material pairings for the most resilient interconnection. The method of test is wire bond pull testing that would represent a continuous strain on a connection and high acceleration testing of up to 50,000 g that would represent a sudden shock that electronics may experience in a drop or crash. Although these two environments may be similar to an overall energy exerted on the connection, the rate of force exerted may lead to different solutions. The results of this research provide insight into material selection for printed electronic interconnections and a framework for interconnection resiliency assessment, which is a critical aspect in realizing the production of next generation electronics technologies for the most demanding environments. |
