Optimized Thermal Simulation Model of Multilayer Printed Circuit Board

Autor: Frivaldsky, Michal, Spanik, Pavol, Morgoš, Ján, Glapa, Norbert
Zdroj: Komunikácie - vedecké listy Žilinskej univerzity v Žiline / Communications - Scientific Letters of the University of Žilina. 20(1):78-81
Databáze: Central and Eastern European Online Library (CEEOL)