Optimized Thermal Simulation Model of Multilayer Printed Circuit Board
Autor: | Frivaldsky, Michal, Spanik, Pavol, Morgoš, Ján, Glapa, Norbert |
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Zdroj: | Komunikácie - vedecké listy Žilinskej univerzity v Žiline / Communications - Scientific Letters of the University of Žilina. 20(1):78-81 |
Databáze: | Central and Eastern European Online Library (CEEOL) |
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