| Autor: |
Kluska, S., Grübel, B., Cimiotti, G., Schmiga, C., Berg, H., Beinert, A., Kubitza, I., Müller, P., Voss, T., Kenny, R., Serra, J.M. |
| Přispěvatelé: |
Publica |
| Jazyk: |
angličtina |
| Rok vydání: |
2021 |
| Popis: |
This work demonstrates that the application of plated Ni/Cu/Ag contacts for TOPCon solar cells and modules is a reliable alternative to screen-printed metallization. Key advantages of plated metallization is a significant reduction of material costs [B. Grübel et al., in Proceedings 11th SiliconPV Conference, Hamelin, 2021, to be published] due to the substitution of a fully printed silver finger by a stack of a thin nickel seed layer (0.5-1 mm height), highly conductive copper finger (3-10 mm height) and an ultra-thin surface finish by tin (1-3 mm height) or silver ( |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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