Preparation and Properties of 3D Screen-Printed RF Components
| Autor: | H.-U. Nickel, G. Addamo, T. Studnitzky, M. Stater, M. Dressler, O. Peverini |
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| Rok vydání: | 2019 |
| Předmět: |
Materials science
business.industry 020208 electrical & electronic engineering chemistry.chemical_element 020206 networking & telecommunications 02 engineering and technology electronic equipment manufacture Rf components Copper filters chemistry 0202 electrical engineering electronic engineering information engineering Optoelectronics Insertion loss Radio frequency Reflection coefficient business |
| Zdroj: | 2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), Bochum, Germany, Germany, 16-18/7/2019 info:cnr-pdr/source/autori:M. Dressler ; T. Studnitzky ; M. Stäter ; O. Peverini ; G. Addamo ; H.-U. Nickel/congresso_nome:2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)/congresso_luogo:Bochum, Germany, Germany/congresso_data:16-18%2F7%2F2019/anno:2019/pagina_da:/pagina_a:/intervallo_pagine |
| DOI: | 10.1109/imws-amp.2019.8880065 |
| Popis: | This paper reports on the preparation procedure of 3D screen printed RF copper components which were (i) printed in stainless steel and subsequently copper plated, and (ii) printed directly in copper. The RF properties were measured and showed promising results for insertion loss and reflection coefficient. |
| Databáze: | OpenAIRE |
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