Study of fatigue failure in Al-chip-metallization during power cycling
| Autor: | Markus Klingler, C. Durand, Daniel Coutellier, Hakim Naceur |
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| Přispěvatelé: | Robert Bosch GmbH, Robert Bosch Campus 1, D-71272 Renningen, Germany, Laboratoire d'Automatique, de Mécanique et d'Informatique industrielles et Humaines - UMR 8201 (LAMIH), Université de Valenciennes et du Hainaut-Cambrésis (UVHC)-Centre National de la Recherche Scientifique (CNRS)-INSA Institut National des Sciences Appliquées Hauts-de-France (INSA Hauts-De-France) |
| Jazyk: | angličtina |
| Rok vydání: | 2015 |
| Předmět: |
Materials science
chemistry.chemical_element 02 engineering and technology Plasticity 01 natural sciences Aluminium 0103 physical sciences MOSFET Hardware_INTEGRATEDCIRCUITS General Materials Science Sensitivity (control systems) 010302 applied physics business.industry Mechanical Engineering Structural engineering [SPI.MECA]Engineering Sciences [physics]/Mechanics [physics.med-ph] 021001 nanoscience & nanotechnology Chip Finite element method chemistry Mechanics of Materials Power module Power cycling 0210 nano-technology business |
| Zdroj: | Engineering Fracture Mechanics Engineering Fracture Mechanics, Elsevier, 2015, 138, pp.127-145. ⟨10.1016/j.engfracmech.2015.02.020⟩ |
| ISSN: | 0013-7944 |
| DOI: | 10.1016/j.engfracmech.2015.02.020⟩ |
| Popis: | IF=1.662; International audience; This paper studies the failure mechanisms occurring in the chip-metallization of a new power module using a copper clip soldered on the top side of the chip, instead of aluminum wire bonds. Both power cycling tests and thermo-mechanical Finite Elements simulations are performed. Simulations of electronic packages is really advantageous: power cycling tests are time consuming and ageing parameters difficult to monitor, whereas simulations allow a detailed study of stresses, plastic strain and even crack growth. A numerical sensitivity study, previously unseen, gives us important information about the influence of test parameters on the mechanical behavior of chip-metallization. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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