Hybrid photonic assemblies based on 3D-printed coupling structures
| Autor: | Xu, Yilin |
|---|---|
| Přispěvatelé: | Koos, Christian, O’Brien, Peter, Freude, Wolfgang |
| Jazyk: | angličtina |
| Rok vydání: | 2023 |
| Předmět: |
dielectric waveguides
tunable laser Multiphotonenlithographie additive 3D Mikrofabrikation 3D-printing photonic integrated circuits (PIC) additive 3D micro-fabrication integrierte photonische Schaltkreise Photonische Aufbau- und Verbindungstechnik photonic integrated circuits photonic assembly micro-optics Mikrooptik microlenses integrated optics photonic packaging Hybrid photonic integration multi-photon lithography ddc:620 multi-photon lithographie external-cavity laser Engineering & allied operations |
| ISSN: | 1865-1100 |
| DOI: | 10.5445/ksp/1000154744 |
| Popis: | Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed as a concept to overcome this technology gap. Multi-photon 3D-lithography is used to fabricate dielectric waveguides ("photonic wire bonds", PWB) as well as facet-attached microlenses (FaML). |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|