Percolated conductive polyaniline-clay nanocomposite in polyvinyl chloride through the combined approach porous template and self-assembly
| Autor: | C. K. Chandrakanth, Rajaraman Ramakrishnan, S. Sivakala, J. D. Sudha, K. S. Neethu, K. N. Rohini |
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| Rok vydání: | 2014 |
| Předmět: |
Nanocomposite
Materials science Polymers and Plastics Dopant Scanning electron microscope General Chemical Engineering Organic Chemistry Emulsion polymerization lcsh:Chemical technology Nanocomposites admicellar emulsion polymerisa chemistry.chemical_compound Polyvinyl chloride Polymerization chemistry Polyaniline lcsh:TA401-492 Materials Chemistry lcsh:Materials of engineering and construction. Mechanics of materials lcsh:TP1-1185 Physical and Theoretical Chemistry Composite material Fourier transform infrared spectroscopy conducting polymers |
| Zdroj: | eXPRESS Polymer Letters, Vol 8, Iss 2, Pp 107-115 (2014) |
| ISSN: | 1788-618X |
| DOI: | 10.3144/expresspolymlett.2014.13 |
| Popis: | In this paper, we are reporting a novel strategy for the preparation of conductive polyaniline-clay nanocomposite in Polyvinylchloride (PVC) matrix by admicellar emulsion polymerization using a low cost renewable resource based sur- factant cum dopant. The highly oriented percolated network of polyaniline-clay nanocomposite in PVC matrix was revealed from the studies made by scanning electron microscopy (SEM) and atomic force microscopy (AFM). Fourier transform infrared spectroscopy (FTIR) results suggested that porous template was formed by the noncovalent interactions among the hydroxyl groups present in the nanoclay edges and the chloride ions present in PVC matrix. Here, the bio-based surfactant, 4-hydroxy-2-pentadecyl benzene-1-sulphonic acid (PDPSA) performed multiple roles of dopant, emulsifier and soft template during the polymerization of anilinium + PDPSA - (An + PDPSA - ) in PVC-clay matrix. The prepared composite exhibited electrical conductivity (!dc) of 4.8·10 -2 S/cm and electromagnetic interference shielding efficiency (EMI SE) of 55.2 dB suggesting it as a prospectable candidate for the encapsulation of electronic devices in high technological applications. |
| Databáze: | OpenAIRE |
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