Improved adhesion of polycrystalline diamond films on copper/carbon composite surfaces due to in situ formation of mechanical gripping sites
| Autor: | Bruno Mortaigne, Jean-François Silvain, Loic Constantin, Mengmeng Wang, Clio Azina, Pierre-Marie Geffroy, Yongfeng Lu, Emilien Feuillet |
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| Přispěvatelé: | Department of Electrical Engineering, University of Nebraska [Lincoln], University of Nebraska System-University of Nebraska System, Institut de Chimie de la Matière Condensée de Bordeaux (ICMCB), Institut de Chimie du CNRS (INC)-Centre National de la Recherche Scientifique (CNRS)-Institut Polytechnique de Bordeaux-Université de Bordeaux (UB), DGA/Mission pour la Recherche et l'Innovation Scientifique (DGA/MRIS), Direction générale de l'Armement (DGA), Science des Procédés Céramiques et de Traitements de Surface (SPCTS), Institut des Procédés Appliqués aux Matériaux (IPAM), Université de Limoges (UNILIM)-Université de Limoges (UNILIM)-Ecole Nationale Supérieure de Céramique Industrielle (ENSCI)-Institut de Chimie du CNRS (INC)-Centre National de la Recherche Scientifique (CNRS)-Université de Limoges (UNILIM) |
| Jazyk: | angličtina |
| Rok vydání: | 2017 |
| Předmět: |
Materials science
mechanical gripping Composite number chemistry.chemical_element 02 engineering and technology Chemical vapor deposition Substrate (electronics) engineering.material 010402 general chemistry 01 natural sciences Thermal conductivity Materials Chemistry surface engineering Composite material Thin film MMC Diamond Surfaces and Interfaces General Chemistry [CHIM.MATE]Chemical Sciences/Material chemistry 021001 nanoscience & nanotechnology Condensed Matter Physics Copper combustion CVD 0104 chemical sciences Surfaces Coatings and Films chemistry diamond deposition engineering 0210 nano-technology Carbon |
| Zdroj: | Surface and Coatings Technology Surface and Coatings Technology, Elsevier, 2017, 321, pp.1-7. ⟨10.1016/j.surfcoat.2017.04.037⟩ |
| ISSN: | 0257-8972 |
| DOI: | 10.1016/j.surfcoat.2017.04.037⟩ |
| Popis: | International audience; Diamond coatings are investigated for thermal management, wear protection and corrosion resistance in harsh environments. In power electronic industries, copper (Cu), which shows high thermal conductivity, is considered as a promising substrate for diamond based heat-spread materials. However, the coefficient of thermal expansion (CTE) mismatch between diamond and Cu induces thermo-mechanical stresses that affect the integrity of the diamond-Cu assembly. In fact, diamond films deposited on Cu substrates tend to peel-off upon cooling due to the compressive stresses present at the diamond-Cu interface. This investigation is focused on the growth of polycrystalline diamond thin films onto Cu/CF (CF) composite materials, using combustion flame chemical vapor deposition (CVD). It has been found that increased CF content in the Cu/CF materials leads to a reduced CTE improving, hence, the adhesion between the diamond film and the Cu/CF substrate and reduces Cu/CF-diamond interfacial residual thermal stresses. At a CF content of 40% in volume, the residual thermal stress of the diamond film deposited on the Cu/CF composite is lower than that on bare Cu and adapted with CVD diamond growth. Naturally engineered composite surfaces have enhanced the adhesion of the diamond film on the composite substrate via mechanical interlocking. |
| Databáze: | OpenAIRE |
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